Toshiba America Electronic Components announced the launch of a new family of NAND flash memory products for embedded applications.
The new products are compatible with the widely used Serial Peripheral Interface (SPI). Toshiba’s new Serial Interface NAND can be used in a wide range of consumer and industrial applications, including flat screen TVs, printers, wearable devices, and robots.
The Serial Interface NAND family consists of 12 products; includes three densities (1 gigabit (Gb), 2 Gb and 4 Gb); two packages (WSON*1 and SOP*2); and two power supply voltages.
The company said sample shipments will start today, and mass production is scheduled to begin with the 1 Gb products in December 2015. Mass production of the remaining products will follow.
Due to its compatibility with the SPI, Toshiba’s new product family can be controlled with just 6-pins, and can be utilized as an SLC NAND flash memory with a low pin count, small package and large capacity.
NOR flash memory is typically used in embedded applications for consumer and industrial devices. However, in order to support the new, enhanced features found in embedded devices, larger memory densities are needed in order to save software and data.
Due to this, demand is increasing for SLC NAND flash memory based on its high density, high reliability and low bit cost when compared to NOR flash memory.
Elsewhere on Wednesday, Toshiba and SanDisk announced the start of equipment installation in the New Fab 2 facility at Yokkaichi Operations.
In a press release, both companies said the new Fab 2 is primarily intended to provide the clean room space necessary to transit a significant portion of the current Yokkaichi 2D NAND capacity to 3D flash memory.
Equipment installation started in New Fab 2 in October 2015 and the facility is expected to be ready for production in the first calendar quarter of 2016.