Semiconductor major said it is the first company that produces MEMS microphones in plastic packages.
STMicroelectronics claims that other MEMS microphone makers still produce devices with metallic lids.
ST’s microphone-assembly process ensures superior electrical and acoustic performance.
Its patented technology innovation advances microphone chip size reduction to 2×2 mm in devices that will soon arrive in the market.
Moreover, this technology development can be used to introduce microphones embedded in silicon cavities.
ST said that its MEMS microphones are ideal for assembly on flat-cable printed-circuit boards that simplify design.
The package technology enables equipment manufacturers to place the sound hole either on the top or the bottom of the package to ensure the slimmest possible design and shortest acoustic path from the environment to the microphone.
According to compression and drop tests, microphones in plastic packages outperform traditional metallic-lid devices in durability.
ST’s plastic-package microphones integrate an internal shielding cage for electromagnetic immunity and are compatible with standard surface-mount assembly machinery and conventional pick-and-place equipment.
ST’s MEMS microphones suit a number of audio applications including mobile phones, laptops and tablets, portable media players, gaming equipment and cameras, as well as noise-cancelling headphones and hearing aids.
The microphones pair with the company’s Smart Voice processors for multi-microphone applications and Sound Terminal audio processing chips, forming a complete one-stop offering for advanced sound-input applications.