Samsung Electronics today said it started the production of 64 GB DDR4 modules for enterprise servers.
This is industry’s first 64 GB DDR4 registered dual Inline memory modules (RDIMMs) that use three dimensional (3D) through TSV package technology, said Samsung.
The new DDR4 modules will be supporting the proliferation of enterprise servers and cloud-based applications, as well as diversification of data center solutions.
Gartner says the global DRAM market is expected to reach $38.6 billion and 29.8 billion units (1GB equivalent) by year-end.
The new RDIMMs include 36 DDR4 DRAM chips, which consists of four 4 GB DDR4 DRAM dies. The chips are manufactured using Samsung’s 20-nanometer (nm) class process technology and 3D TSV package technology.
Jeeho Baek, vice president, memory marketing, Samsung Electronics, said: “By introducing energy-efficient DDR4 modules assembled with 3D TSV, we’re taking a big step ahead of the mainstream DDR4 market, which should expand with the expected introduction of next-generation CPUs in the second half of this year.”
Samsung is planning to stack more than four DDR4 dies using its 3D TSV technology, to create better density DRAM modules. This will accelerate expansion of the premium memory market, in line with an acceleration of the transition from DDR3 to DDR4 throughout the server market.
The server market will account for more than 20 percent of DRAM production this year with approximately 6.7 billion units (1Gb equivalent).